Hydronaut is designed for systems with large-surface heat sinks (such as water cooling systems) and, as a silicone-free compound, can also be used in industrial applications. It can also be applied in the overclocking sector.
Hydronaut can be used for overclocking due to it’s excellent thermal conductivity, but it was created specifically for users with larger-scale cooling solutions, who are looking for a quality product with an excellent price-performance ratio, for example for their water cooling system.
Properties
suited for Overclocking
excellent thermal conductivity
no curing
Silicone-free
no electrical conductivity
Available in four sizes: 1g | 1.5ml | 3ml | 10ml
Specially developed for large-surface heat transfer mediums
The Hydronaut thermal paste delivers optimal heat transfer capabilities for larger-scale cooling solutions like water cooling systems.
Hydronaut thermal paste consists of a silicon-free structure. This makes it very light, highly flexible and easy to apply.
Hydronaut achieves best results if used on medium- to large-scale cooling solutions. This product is ROHS-compliant for demanding users.
The surfaces of processor chips and cooler floors are covered with microscopic dents; ARCTICs...